By Daniel Adams
Silver has the bottom resistivity of all metals, which makes it an enticing interconnect fabric for larger present densities and swifter switching speeds in built-in circuits. over the last ten years, large learn has been performed to deal with the thermal and electric balance, in addition to processing matters which, to this point, have avoided the implementation of silver as an interconnect steel. Silver Metallization: balance and Reliability is the 1st ebook to debate present wisdom of silver metallization and its power as a good candidate for implementation as a destiny interconnect fabric for built-in circuit technology.
Silver Metallization: balance and Reliability presents exact details on a variety of experimental, characterization and research ideas. It additionally provides the radical methods used to beat the thermal and electric balance matters linked to silver metallization. Readers will know about the: - training and characterization of elemental silver skinny movies and silver-metal alloys; - formation of diffusion limitations and adhesion promoters; - evaluate of the thermal balance of silver below varied annealing stipulations; - overview of houses of silver skinny movies less than quite a few processing stipulations; - tools of dry etching of silver strains and the combination of silver with low-k dielectric fabrics.
As a useful source during this rising box; Silver Metallization: balance and Reliability can be very priceless to scholars, scientists, engineers and technologists within the fields of built-in circuits and microelectronics learn and improvement.